SAWIN - Sawing / Dicing Machine

STABLE & ACCURATE WITH INTELLIGENCE

SAWIN is specifically designed to provide a cost effective yet completely reliable sawing and dicing operation. Constructed with enhanced performance features that are fully in compliance with Semi S8-92 Safety Guidelines and S8-95 Ergonomic / Human Factor Guidelines, SAWIN is the ideal sawing solution for semiconductor industrial application. The compact design coupled with easy operation at an affordable price makes it the ideal choice for budgetary planning.

SAWIN 200 - For Max. 8” Wafer/Substrate (Tape or Jig application) - Automatic

FEATURES:
Manual Load / Unload for Wafer Ring or Jig Single-head Spindle Cater up to 8”Chuck table or 210mm work piece Detection sensor for incoming water CS: Contact blade setup & NCS: Non- Contact blade setup PRS-Pattern Recognition System Multi Pattern Recognition Auto Pitch Check Blade Lifespan Monitoring System Hairline & Saw street adjustment capability Multi-Channel Programming BBD-Blade Breakage Detector
PERFORMANCE:
Type of package: Wafer and Substrate Position Accuracy: ±2µm Spindle Speed up to 60K RPM Utilities: 200~240VAC and CDA

SAWIN 300D – Dual Spindle – For Max. 12" Wafer/Substrate (Tape or Jig application) – Automatic

FEATURES:
Manual Load / Unload for Wafer Ring or Jig Dual-head Spindle Cater up to 12”chuck table or 310mm work piece Detection sensor for incoming water CS- Contact blade setup or VBS- Vertical non-contact blade setup (Patented) PRS-Pattern Recognition System Multi Pattern Recognition Auto Pitch Check Blade Lifespan Monitoring System Cut direction setup (Up/down cut) Hairline & Saw street adjustment capability Multi-Channel Programming BBD-Blade Breakage Detector
PERFORMANCE:
Type of package: Wafer and Substrate Position Accuracy: ±2µm Spindle Speed up to 60K RPM Utilities: 200~240VAC and CDA

SAWIN 300DH – Dual Spindle – For Max. 12" Wafer/Substrate (Tape or Jig application) – Fully Automatic

FEATURES:
Load / Unload capability for Wafer Ring Cassette Dual-head Spindle Built-in Auto-washing station Cater up to 12”chuck table or 310mm work piece Detection sensor for incoming water CS- Contact blade setup or VBS- Vertical non-contact blade setup PRS-Pattern Recognition System Multi Pattern Recognition Auto Pitch Check Blade Lifespan Monitoring System Cut direction setup (Up/down cut) Hairline & Saw street adjustment capability Multi-Channel Programming BBD-Blade Breakage Detector
PERFORMANCE:
Type of package: Wafer and Substrate Position Accuracy: ±2µm Spindle Speed up to 60K RPM Utilities: 200~240VAC and CDA